Industries
Use Cases
Camera Driver Development
Image Quality Tuning
Ready-to-integrate camera drivers for Raspberry Pi, NVIDIA, ST, and more. Get your camera module up and running fast on the platform you’re already working with.
Fine-tuned image quality for your exact use case. We calibrate ISP parameters, color accuracy, noise reduction, and HDR to get the best out of your sensor, in any lighting condition.
Color Capture for Smartwatches and Wearables
1.5MP RGB global shutter MIPI module built into the smallest consumer bezels and watch cases.
Color Capture for Smartwatches and Wearables
1.5MP RGB global shutter MIPI module built into the smallest consumer bezels and watch cases.
Color Capture for Smartwatches and Wearables
1.5MP RGB global shutter MIPI module built into the smallest consumer bezels and watch cases.
Smartwatch cameras live in millimetres — case bezels, strap clasps, and crown housings have no room for a conventional sensor stack, and wrist motion turns rolling-shutter capture into a blurry mess. The AE-CCM-GS-VD66GY-C-71 fits a true RGB global shutter into a 6.5 × 6.5 mm footprint, runs 88 fps with embedded auto-exposure on the sensor itself, and draws minimal power from a coin-cell-class battery budget.
1.5MP RGB Global Shutter Camera Module
Built around the ST Microelectronics VD66GY sensor, delivering 1.5 MP at up to 88 fps through a true global shutter and an 84° diagonal RGB lens — engineered for wrist-worn and palm-sized consumer devices. A 3D-stacked BSI pixel design, embedded auto-exposure, and synchronized LED control outputs eliminate host-side ISP overhead, while the 6.5 × 6.5 mm package and dual-lane MIPI CSI-2 interface drop straight into smartwatch and wearable SoC pipelines.
AE-CCM-GS-VD66GY-C-71
Sensor
Resolution
1124 × 1364 px · 2.61 µm pixel pitch
Field of View
F/2.0 fixed-focus lens
Frame Rate
Full-resolution capture · Embedded auto-exposure
SHUTTER
Interface
DIMENSIONS
Fits inside grippers, fingertip sensors, end-effectors
More Modules for Costumer Devices Imaging
Prototype to Payload-Ready in Eigth Weeks.
01
Specification sign-off
Module configuration, lens FOV, flex PCB length, and connector pinout locked at sign-off. No moving targets once production began.
02
End-effector integration
ST’s ready ecosystem — Linux and STM32 SDK, runs on STM32, Raspberry Pi, and NVIDIA from day one.
03
Distribution
Distributed for qualified, repeatable supply at mass production volume.